| 摘要 |
A one handed soldering tool incorporating a heated tip configured with one or more solder retaining recesses therein. Adjacent this heated tip is an end region of a solder supply conduit through which a solid wire solder passes. During operation, as the heated tip is heated, the adjacent end region of the solder supply conduit is likewise heated. Such heating will melt the wire solder therein thereby causing it to flow out of the conduit and into the recesses in the heated tip. This collection of melted solder can then be used to attach a workpiece in place as desired. Consequently, the user is able to support this workpiece during such operation since the step of continuously biasing the solid solder against the heated tip has been eliminated due to the collection of the solder stored in the solder retaining recesses of the heated tip.
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