| 摘要 |
A solder alloy having higher mechanical strengths and excellent wettability, which comprises 0.0005 to 0.35 wt.% of Si, 0 to 5.0 wt.% of Ag, 0 to 10.0 wt.% of Sb, 0 to 10.0 wt.% of Bi, 20 to 95 wt.% of Sn, 0 to 70 wt.% of Pb and 0 to 0.5 wt.% of Ca. |
