| 摘要 |
Sputtering appts. comprises a chamber (100), an electrode (31) carrying a substrate (33), a target (37) which consists of a material to be sputtered onto the substrate, and is attached to an electrode (39), and a screening unit (41) located below the target and insulated from the electrode (39). The appts. has a grid configuration (49) attached to the screening unit (41), and is used for modification of the trajectory of sputter particles.
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