发明名称 |
Method and apparatus for producing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor |
摘要 |
To deposit a film on a substrate (22) by plasma-enhanced chemical vapor deposition at temperatures substantially lower than conventional thermal CVD temperatures, a substrate is placed within a reaction chamber (12) and a first gas is excited upstream of the substrate to generate activated radicals of the first gas. A second gas is supplied proximate the substrate to mix with the activated radicals of the first gas and the mixture produces a surface reaction at the substrate to deposit a film. Rotation of the substrate draws the gas mixture down to the substrate surface in a laminar flow (29) to reduce recirculation and radical recombination. Another method utilizes a gas-dispersing showerhead (298) that is biased with RF energy to form an electrode which generates activated radicals and ions in a concentrated plasma close to the substrate surface. |
申请公布号 |
AU2764095(A) |
申请公布日期 |
1996.01.04 |
申请号 |
AU19950027640 |
申请日期 |
1995.06.01 |
申请人 |
MATERIALS RESEARCH CORPORATION;COMMISSARIAT A L'ENERGIE ATOMIQUE |
发明人 |
ROBERT F FOSTER;JOSEPH T HILLMAN;JACQUES FAGUET;CHANTAL ARENA |
分类号 |
C23C16/14;C23C16/34;C23C16/44;C23C16/452;C23C16/455;C23C16/458;C23C16/509;H01L21/285;H01L21/3205 |
主分类号 |
C23C16/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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