Carrier for carrying semiconductor device

摘要

A carrier 41 for a semiconductor device which comprises a plurality of leads (225) respectively made up of an inner lead (5, 93a, 225a) and an outer lead (8, 93b, 225b), a semiconductor chip (4, 223) electrically connected to the inner leads of the leads, and a package (7, 221) encapsulating at least the inner leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package (7, 221) has an upper part (7a, 221a) and a lower part (7b, 221b) which have mutually different sizes such that a stepped portion is formed between the upper and lower parts by the different sizes, and each of the outer leads (8, 93b) has a wide part (21) which is wider than other parts of the outer lead extending outwardly of the package only within the stepped portion of the package. The carrier has a sidewall 42 and locking parts 43a-43d, 44a-44d. The sidewall protects the outer leads from mechanical damage.