Silicone pressure sensitive adhesive composition

摘要

Silicone pressure sensitive compositions that combine high ultimate strength in a cured network with a lower modulus and improved adhesive strength at elevated temperatures are disclosed. These compositions are comprised of (A) a soluble, capped, organopolysiloxane resin containing less than 1.2 weight percent silicon-bonded hydroxyl groups based on the total weight of (A); (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least two silicon-bonded hydrolyzable radicals said polymer having a viscosity at 25 DEG C. of 20 to 100,000 mm<2>/s; and (C) a hydrolyzable silane.