| 摘要 |
An automatic plunger apparatus is disclosed for compressing molten plastic into a cavity for forming an encapsulated semiconductor device. A compressing device drives a plunger member in order to compress and direct molten plastic to flow in a forward direction into the cavity. An overload compensator is coupled to the plunger member for permitting the plunger member to withdraw in a reverse direction when the plunger member is prevented from compressing and directing the molten plastic to flow in the forward direction into the cavity. The overload compensator includes a first member retained within a second member for transferring the force from the compressing device into motion of the plunger member. When the plunger member is prevented from compressing and directing the molten plastic to flow in the forward direction into the cavity, the first member pops out of the second member in order to permit the plunger member to withdraw in a reverse direction, thereby protecting the plunger, the cavity, and the semiconductor device.
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