Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same

摘要

The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: <IMAGE> wherein R1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R1 may be identical or different when l is 2 or more, R2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R2 may be identical or different when m is 2 or more, R3 independently represents a hydrogen atom or an alkyl group of 6 or less carbon atoms, the average recurring unit number n is 0-10, l is 0-4 and m is 0-7, and can be contained as a curing agent in an epoxy resin composition which is used not only for giving cured products but also for encapsulating semiconductor devices.