发明名称 Automatic soldering apparatus
摘要 An automatic soldering apparatus and method includes compressed air pipes on both sides of a ceramic foaming tube to prevent through holes of the ceramic foaming tube from being clogged by a foreign substance and to constantly maintain the air pressure within the ceramic foaming tube for uniform dimension of foaming flux and uniform foaming height, thereby performing uniform flux treatment upon a circuit board to eliminate inferiority caused by the foaming flux.
申请公布号 US5478004(A) 申请公布日期 1995.12.26
申请号 US19940309584 申请日期 1994.09.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, SANG-HONG
分类号 B23K1/20;(IPC1-7):B05C5/02;B23K3/00;H05K3/34 主分类号 B23K1/20
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