发明名称 |
Automatic soldering apparatus |
摘要 |
An automatic soldering apparatus and method includes compressed air pipes on both sides of a ceramic foaming tube to prevent through holes of the ceramic foaming tube from being clogged by a foreign substance and to constantly maintain the air pressure within the ceramic foaming tube for uniform dimension of foaming flux and uniform foaming height, thereby performing uniform flux treatment upon a circuit board to eliminate inferiority caused by the foaming flux.
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申请公布号 |
US5478004(A) |
申请公布日期 |
1995.12.26 |
申请号 |
US19940309584 |
申请日期 |
1994.09.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, SANG-HONG |
分类号 |
B23K1/20;(IPC1-7):B05C5/02;B23K3/00;H05K3/34 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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