Known-good die testing apparatus

摘要

A die testing apparatus according to the present invention includes a lead frame having a plurality of die pads, wherein a plurality of bare chips are mounted on the die pads. The bonding pads of each bare chips are connected to a plurality of leads associated with each die pad through a plurality of bonding wires. The die pads are supported by a plurality of tie bars and the leads are supported by an adhesion tape attached to the lead frame. The lead frame is placed in a test socket which includes an under socket having a plurality of slot grooves and an upper socket hinged with the under socket and having a plurality of slot holes and a plurality of test probes contacting the leads of the lead frame. The lead frame is fixed between the upper and under sockets by means of a plurality of pins penetrating the slot holes and guiding holes located at a periphery of the lead frame and then being inserted into the slot grooves, and one side of the lead frame is caught between the upper and under sockets by a clamp. The test socket has a plug portion with electrical contacts thereon, which is located at an edge of the socket so that it can be plugged into a testing board.