| 摘要 |
<p>PURPOSE:To provide a handling jig capable of simply supporting articles to be handled having different size positively regarding an improvement in the handling jig used in the manufacturing process of a semiconductor device. CONSTITUTION:First and second operating sections 1a, 2a are mounted at one ends respectively, first and second supporting sections 3, 4 are installed at the other ends respectively, and fulcrum holes 1b, 2b are formed near the operating sections 1a, 2a respectively. A handling jig consists of a pair of arms 1, 2 bonded by a pin 5 fitted into the fulcrum holes 1b, 2b, pins 6, 7 fitted into holes 1c, 2c formed near the fulcrum holes 1b, 2b of the arms 1, 2, a pair of links 9, 10 having holes fitted to the pins 6, 7 at one ends respectively and sharing a pin 8 fitted into each hole at the other ends, and a third supporting section 11 mounted while being fitted to the pin 8. The handling jig is formed so as to support an article to be handled by the first supporting section 3, the second supporting section 4 and the third supporting section 11.</p> |
