| 摘要 |
PURPOSE:To provide a method for forming a thin-film wiring having high yield of a board by reliably and efficiently inspecting and correcting a defect during the thin-film wiring forming step. CONSTITUTION:A method for forming a thin-film wiring comprises the steps of d1 covering the surface of a metal thin film A with other metal thin film B, d2 forming a resist pattern on the film A, d3 exposing the film A by selectively etching only the film B of the other film B, d4 filling plating metal in the exposed part of the film A based on a resist pattern, and d5 separating the resist. Accordingly, the steps of inspecting to recognize the defect by detecting a pattern image and correcting the defect is added between the steps d3 and d4. |
