METHOD AND APPARATUS FOR LASER SOLDERING OF FILM CARRIER

摘要

PURPOSE:To conduct an accurate and appropriate bonding of leads in the mounting of a TAB film carrier by installing a pressing jig which is so structured as to move up and down above the film carrier and by which parts of leads near end sections of the leads can be pressed. CONSTITUTION:A plurality of leads 13 of a film carrier 11 which are fastened and supported by the film base material 12 and pads 21 formed on a mounting board 20 are aligned and then laser light 6a is cast along the leads 13 to solder- bond the leads 13 and the pads 21. In such a laser soldering equipment, a pressing jig 2 which is structured so as s to move up and down above the film carrier 11 placed at a position set to the mounting board 20 which is fixed at a specified place and which can press parts of the leads 13 near end sections of the leads 13 of the film carrier 11 is provided. The leads 13 are bonded to the pads 21 by means of the pressing jig 2.