| 摘要 |
PURPOSE:To provide a production process of a composite circuit board hating signal circuit conductors and power circuit conductors, excellent in productivity whereby a three-dimensional structure can be also made, by applying the insert forming method of power circuit conductors to a heat-resistive synthetic resin contg. an electroless plating catalyst. CONSTITUTION:Power circuit conductors 1 are charged in a die, a molten heat- resistive synthetic resin contg. an electroless plating catalyst is injected to form an insulative board 5 contg. the conductors 1. After forming a resist layer 7 on the board 5, except a signal circuit pattern, an electroless plating is applied to form signal circuit conductors on the board 5 and specified signal circuit conductors are conductively connected to the conductors 1 through through-holes 2 to form a composite circuit board. |
