| 摘要 |
PURPOSE: To prevent leak of mold compound from circumference of mold cavity, by forming a seal to the vicinity of lead with a deformable material arranged at a recess of the mold. CONSTITUTION: In order to determine a molding volume filled with a mold compound, a first and a second mold sections are arranged at the surface provided opposed respectively to the integrated circuit chips 12, 13 and lead frame 15. The boundary region of both molding sections is formed of the isolated surfaces of both molding sections at the opposed surface of a plurality of isolated leads 31, and one of both molding sections has recesses 20 to 23 extending along the boundary lead. Moreover, the deformable materials 26 to 29 which are arranged to the recesses 20 to 23 and extending therefrom in the predetermined amount are also provided. When both molding sections are pushed with each other, the deformable materials 26 to 29 are deformed to form the seal in the vicinity of the isolated leads 31. |
