| 摘要 |
PURPOSE:To easily manufacture a thin multilayer printed circuit board with a non-penetrated hole by conducting series of steps of punching a viahole while repeating winding and rewinding of a rolled copper foil, and laminating the foil. CONSTITUTION:A method for manufacturing a multilayer printed circuit board comprises the steps of providing an insulating adhesive layer 2 on a copper foil 1 while rewinding the rolled copper foil 1, then punching a through hole 3 to become a viahole while rewinding the wound roll, thereafter laminating the foil 4 while rewinding the wound roll, winding it on the roll while curing the layer 2, forming the hole 3 to a non-penetrated hole, then forming an etching resist 5 for forming a wiring pattern on the surface of the foil 4 in which the hole 3 of the board is not opened, removing the foil, thereafter superposing it via insulating adhesive 6 between the inner layer board formed with the wiring and other board 7, pressuring it, heating it, integrating the layer, and then printing conductive paste 8 to conduct a connecting hole between the layers. |
