| 摘要 |
<p>PURPOSE:To provide paste for forming electrodes on chip resistors capable of adhering to a board with a strong adhesion strength, and excellent in antisulfidization. CONSTITUTION:Concerning to paste for the electrodes on chip resistors made by scattering conductive powder, glass frit, and an inorganic binder in an organic vehicle, conductive powder is produced with globular silver powder of an average grain diameter 0.1-0.5mum and globular silver-coated palladium powder of an average grain diameter 0.5-1.5mum. It is desirable that the ratio (weight %) of the coating silver to palladium should be 15:85 to 40:60. And it is desirable that glass frit having a surrendering temperature of 400-550 deg.C and a thermal expansion coefficient of 5.0-9.5ppm/ deg.C should be used. Besides, 70-75 pts.wt. of silver powder, 0.5-1.0 pt.wt. of silver-coated palladium powder, and 0.5-1.5 pts.wt. of glass frit are added to 100 pts.wt. of paste.</p> |
