| 摘要 |
PURPOSE:To facilitate mass production of chip-like electronic components which exhibit satisfactory fixing property when soldered to a base. CONSTITUTION:In manufacture of a chip-like electronic component, an element 1 is covered with a plastic package 2a by a transfer-molding method or an injection-molding method, and recesses and protrusions are formed on an electrode part 2b of the plastic package, using a plastic package metal mold in which recesses and protrusions are formed by discharge-processing at least in a portion corresponding to the electrode part of the chip-like electronic component. Then, an electrode 3 or an underlayer of the electrode 3 is formed by plating or coating with a conductive material, or their combination. |
