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发明名称
Packung für Halbleiteranordnung und Dichtungsverfahren dafür.
摘要
申请公布号
DE69023531(D1)
申请公布日期
1995.12.21
申请号
DE1990623531
申请日期
1990.04.12
申请人
SUMITOMO ELECTRIC INDUSTRIES, LTD., OSAKA, JP
发明人
NISHIGUCHI, MASANORI, C/O YOKOHAMA WORKS OF, YOKOHAMA-SHI, KANAGAWA, JP
分类号
H01L23/02;H01L21/00;H01L21/50;H01L23/10;(IPC1-7):H01L23/10
主分类号
H01L23/02
代理机构
代理人
主权项
地址
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