A CAPSULE-STIFFENING ARRANGEMENT AND A METHOD FOR ITS MANUFACTURE

摘要

The present invention relates to an arrangement for stiffening electronics-housing capsules. According to the invention, the interspace between the capsule (2) and the electronic circuit board (1) is filled with plastic foam (4). The invention also relates to a method of producing a capsule-stiffening arrangement, in which a cross-linked plastic foam insert (5) is compressed and placed in the capsule cavity and thereafter heated so as to expand and fill the cavity, the plastic foam therewith stiffening the capsule walls and avoiding microphony.