发明名称 |
Method for selectively treating wells with a low viscosity epoxy resin-forming composition |
摘要 |
Method for selectively treating wells using a low viscosity epoxy resin-forming composition containing a single curing agent. The composition comprises a liquid bisphenol A-based epoxy material and a polyamide hardener for ambient temperature curing of the liquid epoxy material. The epoxy material has a very low viscosity at well surface temperatures and is immiscible with well fluids. The polyamide curing agent used is an amber-colored mobile liquid having a low viscosity at ambient temperature and is further characterized as having long pot life and low exotherm. The method is applicable to plugging permeable zones in a gravel-packed well and may be used to repair leaks in well casing or production tubing and in cementing to prevent communication between subterranean regions. |
申请公布号 |
AU7042494(A) |
申请公布日期 |
1995.12.18 |
申请号 |
AU19940070424 |
申请日期 |
1994.05.23 |
申请人 |
TERRY R. DARTEZ;ROY K JONES |
发明人 |
TERRY R. DARTEZ;ROY K JONES |
分类号 |
C09K8/508;E21B33/13 |
主分类号 |
C09K8/508 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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