METHOD AND APPARATUS FOR LOW TEMPERATURE DEPOSITION OF CVD AND PECVD FILMS

摘要

Low temperature deposition of CVD and PECVD films utilizes a gas-dispersing showerhead (36) position within one inch of a rotating substrate. The showerhead is positioned a suitable distance below a gas-dispensing ring (50, 52) such a steady state flow of gas develop, between the ring and showerhead. A cylindrical structure extends between the gas-dispersing ring and a showerhead to contain the gas over the showerhead yielding a small boundary layer over the substrate. The showerhead is biased with RF energy such that it acts as an electrode to incite a plasma proximate with the substrate for PECVD. The cylinder (60) is isolated from the showerhead such as by a quartz insulator ring (62) to prevent ignition of a plasma within the cylinder, or alternatively, the cylinder is fabricated of quartz material. The RF showerhead utilizes small gasdispersing holes (54) to further prevent ignition of a plasma within the cylinder.