| 摘要 |
<p>PURPOSE:To economically manufacture a Cu-type bar material most suitably used for electronic equipment parts by plating a base material of Cu alloy bar with high-purity Cu and by rolling the plated material so as to reduce the surface layer Cu to specified thickness. CONSTITUTION:The base material of Cu alloy bar is subjected to high-purity Cu plating or PVD treatment; the Cu used here is oxygen-free copper. After that the material is worked by rolling at >=10% total draft by use of smooth rolls for rolling and a low-viscosity lubricant in combination so as to reduce the thickness of the Cu surface layer to 0.5mu, preferably 1-5mu. In this way, the high quality and high efficiency Cu bar material most suitably used for electronic equipment parts can be obtained.</p> |
