| 摘要 |
Ball grid array devices 10 are mounted in a burn-in and test socket which has a top surface 22 with windows 23 for the ball terminals 12 depending from the ball grid array device. Contact fingers 40 mounted on the base 21 of the socket extend through a bending plate 28 and into the windows 23 from the opposite side of the top surface. When the bending plate is moved laterally with respect to the top surface, e.g. by rotation of cam 50, the ends of the contact fingers 40 are moved into contact with the ball terminals 12. The ends 42a of the contact members are urged into contact with the ball terminals between the center of the ball terminal 12 and the surface of the ball grid array device 10, thus retaining the device in the socket. <IMAGE> |
