Process for pretreating a substrate surface for bonding with plastic by applying a layer and use of a possibly silanated and/or silanated silicon-containing compound

摘要

For preparation for bonding with plastic, a layer is applied to a substrate surface by sand blasting with an agent which consists of (A) 0.01 to 90% by weight of optionally silanised material having a particle size of < 5 mu m and a greater hardness than that of the substrate surface and/or (B) 20 to 100% by weight of silanised, silicon-containing material having a mean particle size of 2 to 200 mu m, (C) the remainder being a sand-blasting agent having a mean particle size of > 5 mu m, and the said layer is, if required, then silanised.