| 摘要 |
PURPOSE:To effectively evaluate the degree of adhesion of a photoresist formed on the surface of a flat plate such as a semiconductor wafer. CONSTITUTION:This mask 1 for evaluation is a sheet having plural sections of patterns formed. Each section consists of a pattern 3 of lines 2 having different density and length and a pattern 5 of dots 4 having different density and size. A photoresist is applied to the surface of a semiconductor wafer S by using this mask 1, exposed and developed to form patterns on the surface. The patterns formed on the surface is visually checked with a microscope to check the adhesion or peeling state of the photoresist. |
