| 摘要 |
PURPOSE:To prevent the misregistration of a bare chip mounting substrate against a main substrate at the reflowing time by putting a positioning cover which covers a light receiving sensor chip and also works as a filter in a light receiving window for sensor formed through the main substrate. CONSTITUTION:A positioning cover 22 which also works as a filter is constituted in a bottomed hollow body and fixed fo a small substrate 17 so as to cover an infrared sensor chip 18. The outside dimension of the cover 22 is adjusted so that the cover 22 can be put in a light receiving window 12a for sensor formed in a main substrate 12. Therefore, the misregistration of a bare chip mounting substrate 16 against the main substrate 12 can be prevented, because reflow soldering can be performed after the bare chip mounting substrate 16 is put on the main substrate 12 so that the cover 22 can be put in the window 12a.
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