| 摘要 |
PURPOSE:To protect a circuit pattern against deformation by a method wherein multilayered copper clad laminate inner members are provided in layers onto a copper foil as separated from each other, another copper foil is laid on them and all the laminated components are thermocompressed into a multilayered laminate of integral structure. CONSTITUTION:N sets of prepregs 21, 22... and prepregs 41, 42... as the inner members of a four-layered copper plated laminate are successively piled up in layers in this sequence on a copper foil 1 providing a space (5 to 15mm or so) between them, a copper foil 5 as an outer member is piled up on them, and all the piled up components are thermocompressed as sandwiched in between hot platens. The resin component of prepreg is melted and turned fluid, and as the fluid resin is made to flow to a vacant space provided between the adjacent inner members between the copper foils 1 and 5 by a pressure applied by the hot platens, pressure becomes uniform through a thermocompressed laminate as a whole. The fluid resin is cured by reaction as the compressed laminate is kept in this state, so that n sets of the inner members are turned into a flat plate of integral structure, and an inner circuit pattern is less deformed. |
