| 摘要 |
PURPOSE:To decrease the loop height on a pellet and prevent imperfect connection due to thermal stress, by constituting the inner lead side of a bonding wire as a hall form, and constituting the bonding pad side of the bonding wire as a stitch form. CONSTITUTION:When a semiconductor pellet is bonded to an inner lead 13 by using a bonding wire 10, bonding is performed from the side of a silver-plated surface 13A of the inner lead 13 to the side of a bonding pad 15 on the surface of a semiconductor pellet 11. The bonding is performed on the inner lead 13, so that the bonding wire 10 whose main component is gold is turned into a ball form 10B by the pressure bonding of a capillary. The wire bonding is terminated on the bonding pad 15, so that the bonding wire 10 is turned into a stitch form 10A. Since the inner lead side is constituted as a ball form, imperfect connection which is to be caused by the influence of thermal stress due to material difference can be prevented. Since the bonding pad side is constituted as the stitch form, the height on the pellet can be decreased. |
