| 摘要 |
<p>PURPOSE:To restrain product defective such as disconnection of a device wiring by minimizing generation of dust when film formation of a semiconductor wafer mounted on a semiconductor wafer mounting boat is finished and unloaded from it. CONSTITUTION:In the title semiconductor wafer mounting boat, a recessed groove 804A which has a depth attaining nearly a central part of a supporting rod 801A and is about twice as thick as a semiconductor wafer S is formed roughly all over an entire length of a supporting rod 801A at a specified pitch, and each recessed groove 804A is constructed so that a lower surface of each recessed groove 804A constituting a surface 806A of a semiconductor wafer mounting shelf 805A tilts upward toward an opening part 809 to make the opening part 809 thereof narrow a little.</p> |
