| 摘要 |
PURPOSE:To electrically connect a semiconductor substrate with wirings buried in the semiconductor substrate, without using a process for forming a fine contact hole pattern. CONSTITUTION:When wirings (buried bit lines BL (15) buried in a silicon substrate 1 are formed, semiconductor substrate regions 1-2a protruding on the side of trenches for burying the bit lines are formed, and the silicon substrate 1 is connected with the wirings. Thereby the silicon substrate 1 can be conducted with the wirings without using a process for forming a fine contact hole pattern. |
