| 摘要 |
PURPOSE:To inexpensively manufacture a semiconductor device which can provide a package for semiconductor device which can be increased in the number of pins. CONSTITUTION:A semiconductor device is provided with a metallic core substrate 12 on which a semiconductor chip 11 is mounted, internal wiring pattern 14 formed of copper foil, etc., on the surface of the substrate 12 on which the chip 11 is mounted, outer leads 20 electrically connected to the pattern 14 on the surface of the substrate 12, and frame body 22 which is bonded to the surface of the substrate 12 on which the chip 11 is mounted, with the leads 20 being held between the frame body 22 and the substrate 12. |
