发明名称 SPOOL FOR BONDING-WIRE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To secure electric conductive even if a bonding wire is loosened, from a flange by forming a projection at the corner part of the flange of a spool, winding the bonding-wire by one turn on the projection, and fitting the starting end of the bonding-wire by an adhesive tape. CONSTITUTION:The starting end of a bonding-wire 1 is fixed by an adhesive tape, and after the bonding-wire 1 is wound by one turn on a projection 8, the wire is wound on a cylindrical part 3. The bonding-wire 1 thus taken up on a spool 6 is rewound and supplied onto a bonder. Accordingly, the starting end of the bonding-wire 1 is firmly fixed on a flange 2, and the trouble that the adhesive tape 7 is exfoliated or the tape is floated up from the spool 6, and the wire is loosened, and the starting end of the bonding-wire 1 is separated from the flange 2, and electric conduction is disabled is prevented.
申请公布号 JPH07323964(A) 申请公布日期 1995.12.12
申请号 JP19940141117 申请日期 1994.05.31
申请人 MITSUBISHI MATERIALS CORP 发明人 FURUKAWA KIYOSHI;MATSUMOTO KOJI;MATSUZAWA MASANOBU
分类号 B65H75/14;B65H75/28;H01L21/60 主分类号 B65H75/14
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