| 摘要 |
PURPOSE:To obtain a clean plating surface and to denote excellent wire bondability by a method wherein substrate surface is washed by an aqueous solution, containing hydrogen peroxide and ammonia, after gold-plating. CONSTITUTION:After roughening the surface of a molded substrate, a thin base metal film is formed using the method such as ion-plating and the like. Then, a uniform photoresist layer is formed on the surface of the molded substrate where a metal film is formed, and a plated resist pattern is formed by exposing and developing through a photomask. An electroplated layer is formed on the exposed base metal layer corresponding to a printed wiring pattern by conducting electroplating. Pertaining to the electroplating, first, the surface- smoothing base plating such as glossy nickel and the like is provided, then gold plating is provided, and the plated resist and the base metal film, located under it, on the unnecessary part are stripped. Then, the substrate is heat- treated, the gloss agent, which is possible to ooze out, is oozed out to the surface of gold plating, and the substrate is washed by the aqueous solution containing hydrogen peroxide and ammonia. |
