Semiconductor device having an alignment mark

摘要

A semiconductor device having an alignment mark which is improved to enable accurate recognition of the alignment mark is provided. A first interconnection layer is provided on a semiconductor substrate. A second interconnection layer is provided on an interlayer insulating film so that first and second interconnection layers cross each other with interlayer insulating film therebetween. A surface of second interconnection layer includes, in a region where first and second interconnection layers cross each other, a flat portion which reflects laser beam vertically and upwardly and a portion including concaves and convexes which reflects laser beam irregularly, which together form an alignment mark.