| 摘要 |
PURPOSE:To obtain a forming method of a photoresist film and a photoplate capable of eliminating dusting due to fine chips of a resist film when peeling. CONSTITUTION:In the first means of the forming method, a metallic light- shielding film 3 is formed on the surface of a substrate 2, a hydrophobic area 7 is formed by implanting ions into a specified area of the light-shielding film 3, and a photoresist film 8 is formed on the light shielding film 3 while the film 8 is repelled in the hydrophobic area 7. In the second means, a photoplate as the master plate to produce a mask or reticle is produced. A hydrophobic area 7 is formed by implanting ions in a specified area of the light-shielding film 3 formed on the surface of the substrate 2, and a photoresist film 8 is formed on the light-shielding film 3 while the film 8 is repelled in the hydrophobic area 7. |
