| 摘要 |
PURPOSE: To mass produce a semiconducotr device constituted with many substrates including a flip chip type mutual connector by disposing a magnet slidably outside a frame for applying force of a previously selected magnitude to a holding plate after a second substrate is matched with a first substrate. CONSTITUTION: For setting required matching between a mutual connector on a first substrate 20 and a mutual connector 26 on a second substrate 22, a base 44 is used to mutually adjust a matching assembly 90 and a frame assembly 50. Hereupon, the magnitude of the adjustment is obtained such that force applied between the first and second substrates 20, 22 is determined through magnetic attraction force between a plurality of magnets 60 and a holding plate 96 by disposing a bearing 58 including the magnets 60 slidably outside a container 52. Hereby, there is mass produced a semiconductor device constituted with many substrates including a flip chip mutual connector. |
