| 摘要 |
Resin composition comprising 8-10 parts by weight of a polyphenylene ether resin, 90-20 parts by weight of a polyamide resin, and 30-70 parts by weight, per 100 parts by weight of the polyphenylene ether resin and the polyamide resin combined, of a plate or flake like inorganic filler wherein the inorganic filler has an average particle size of no more than 5 mu m and as aspect ratio of no less than 3 and wherein the difference between the crystallization initiation temperature of a composition comprising 90 weight percent polyamide and 10 weight percent of the inorganic filler and the crystallization initiation temperature of the polyamide resin is 5 DEG C. or less. The resin compositions have excellent surface smoothness, high rigidity, a small linear expansion coefficient, and good impact resistance, heat resistance and chemical resistance.
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