| 摘要 |
PURPOSE:To obtain an ultrasonic thermocompression bonding device making it possible to reduce the expansion of an ultrasonic horn and to attain precise joining of a bump, regarding the ultrasonic thermocompression bonding device used on the occasion of forming the bump on a semiconductor chip, in particular. CONSTITUTION:In an ultrasonic thermocompression bonding device which has a capillary 3 holding a conductive wire 5, an ultrasonic horn 4 transmitting an ultrasonic wave to the capillary 3 and a motor 7 moving the ultrasonic horn 4 and forms a bump on a semiconductor chip 2 placed on a heater 1, a cooling mechanism 6 for cooling the ultrasonic horn 4 is provided. |
