发明名称 PACKAGE FOR ELECTRONIC ELEMENT
摘要 PURPOSE:To provide a package for electronic element which has a durability to the moisture penetrating it. CONSTITUTION:When a moisture absorbing means 8 is provided in the inner part region of the package wherein an electronic element 5 is sealed, the moistur penetrating the package from the outside is absorbed by this moisture absorbing means 8, and there is no dew formation in the package. Since an adhesive substance 82 mixed with an moisture absorbing substance 81 is soft, when the moisture is absorbed by the moisture absorbing substance 81, the expansion stress generated by its expansion is relaxed, and any unnecessary stress is not given to its periphery. That is, until its moisture absorbing ability is attenuated, the electronic element 5 is protected from the adverse effect of the moisture, and the life time of the electronic element 5 is lengthened. Also, if the conventional package type is provided with the moisture absorbing means 8, the moisture is absorbed in the inner part of the package, and the deteriorating speed of the electronic element is suppressed. Also, this moisture absorbing means 8 can absorb the out gas generated in the package in case of the sealing of the electronic element too.
申请公布号 JPH07321251(A) 申请公布日期 1995.12.08
申请号 JP19940138042 申请日期 1994.05.27
申请人 NIPPONDENSO CO LTD 发明人 MIZUNO NAOHITO;IMAI MASATO;KANAMARU KENJI
分类号 H01L23/02;H01L23/26 主分类号 H01L23/02
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