| 摘要 |
PURPOSE:To improve solder connecting strength between outer lead and substrate. CONSTITUTION:Each outer lead 12 of SOJ.IC1 is bent and formed in the shape of alphabet 'J' and a solder pool 16 is formed at the loer surface of the mounting part 12b. Thereby, when SOJ.IC1 is mounted by soldering on a printed wiring board 20, the soldering part 23 is formed to surround the periphery of the mounting part 12b of the outer lead 12 and moreover it is also formed in the solder pool 16. Accordingly, solder contact area increases, improving soldering connection strength between the outer lead 12 and substrate 20. |
