| 摘要 |
PURPOSE:To form a fine-pitched solder bumps of substantially equal height on IC electrodes in a short period by a method wherein solder paste is filled in the aperture parts formed on a heat-resisting photoresist layer, and the filled solder paste is sphered by heating. CONSTITUTION:A solder bump is formed on the electrode 2 of a semiconductor wafer 1 where an IC and the like is formed. In this case, after a burrier metal layer 4 has been formed on the electrode 2, heat-resisting photoresist 5 is coated thereon, and after the photoresist 5 has been exposed using a mask, the photoresist 5 is developed, and an aperture part 6 is formed on the photoresist 5. Then, solder paste 9 is filled in the aperture part 6 by printing, the filled up solder paste 9 is heated up and it is sphered. For example, the solder paste 9 is filled in the aperture part 6 formed on the photoresist 5 using a squeegee. Then, the solder paste 9 is melted by conducting reflow heating and the like, and a spherical solder bump 10 is formed. |
