| 摘要 |
<p>PURPOSE:To provide a dicing device which can decrease the generation of defective wafers. CONSTITUTION:A wafer 10 fixed on a processing table 17 is subjected to cutting work by a blade 19, which is rotated by a spindle motor 21, and thereafter, the wafer 10 is fixed on a cleaning table 25. The table 25 is rotated and cleaning water is supplied to the wafer 10, whereby the surface of the wafer 10 is cleaned. A pattern of the surface of the wafer 10 subsequent to the cleaning is caught by a dirt inspection microscope 27 provided over the wafer 10 and the image of the pattern is fed to an image processing device. The image processing device compares image data on the surface of the wafer 10 subsequent to this cleaning with previously stored that on the surface of the wafer 10 prior to the cutting and detects a dirt on the surface of the wafer 10. When the detected dirt exceeds a prescribed amount, an NC device changes a cleaning time, a cutting rate and the like to modify a cleaning condition and a cutting condition.</p> |
