| 摘要 |
PURPOSE:To integrate a shield for shielding a semiconductor chip from noises into a resin body for sealing the semiconductor chip and concurrently maintain the accuracy of the outside dimension of a resin-sealed type semiconductor device. CONSTITUTION:A semiconductor chip 2 mounted on an island 1 is covered with mesh-form metallic plates 5 respectively formed after half squirrel-cages both from above it and from under it, and the metallic plates 5 are connected respectively with a grounded pin. A resin is injected into the insides of the metallic plates 5 through their meshes, and the semiconductor chip 2 is sealed therewith. A semiconductor device is so molded with the resin that the mesh- form metallic plates 5 are included in a resin body 6. |
