WIRING BOARD AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE EQUIPPED WITH IT

摘要

PURPOSE:To easily match a signal wiring of a semiconductor integrated circuit device in characteristic impedance without raising the semiconductor integrated circuit device in cost but and to enhance a bump joint between a semiconductor electronic part and a wiring board in reliability. CONSTITUTION:Signal wirings 6 are formed on the surface of a package board 1a, and a frame-like dam 7 which specifies a joint between the wiring 6 and a bump electrode in area is provided to the tip of each signal wiring 6.