| 摘要 |
PURPOSE:To enable high density surface mounting, even in the case of connecting a joining part at a fine narrower pitch with a wiring plate by forming wider connecting area with the wiring plate of a small number of joining portions in comparison with each connecting area with the wiring plate of the other joining part. CONSTITUTION:An electrode of IC chip 1 and a lead 2 consisting of a lead frame of a conductive metal plate are conductively coupled with a wire bonding 3 and is then packaged with a sealing resin 4. Moreover, each joining area of a wiring plate 9 of a very small number of joining portions among a plurality of joining portions conductively coupled with electrode of IC chip and connected to a wiring plate 8 projected toward outside is formed in several times to several tens times in comparison with each connecting area with the wiring plate 9 of the other joining portions. The joinint portion is outer leads 5, 6 consisting of lead frame of metal plate, outer leads 5, 6 consisting of metal foil and a connecting pad, etc. Therefore, reliable soldering can be realized even in the case of high density surface mounting. |
