| 摘要 |
<p>PURPOSE:To obtain a multilayer board in which the heat generated from an electronic device is transmitted on a thermal conductor to a fin and dissipated therefrom by connecting heat dissipation conductors arranged between respective layers of a multilayer board with the thermal conductor arranged from the electronic device mounting side to the heat dissipation fin mounting side. CONSTITUTION:Three thermal conductors 2 are arranged to penetrate a multilayer board 1 in the thickness direction thereof and heat dissipation conductors 10 are arranged between the layers of the board 1 in order to couple the thermal conductor 2 thermally. Furthermore, a heat dissipation conductor 11 is arranged at a position for mounting an electronic device 4 on the surface layer of the multilayer board 1 and the thermal conductors 2 are coupled thermally. A heat dissipation conductor 12 is also arranged at a position for mounting the heat dissipation fin in order to couple the thermal conductor 2 thermally. Heat generated from the electronic device is transmitted through the conductor 11 to the conductor 2 thence through the conductor 12 to the heat dissipation fins and dissipated therefrom.</p> |
