| 摘要 |
The semiconductor IC having semiconductor devices and chip components is provided with a substrate (1), having an opening (1A), that is bonded onto a heat-sinking substrate (2) for mounting the chip components. A high thermally conductive base plate (3), e.g. of Kovar, is bonded to the heat-sinking substrate for mounting the semiconductor devices. A hollow cover (4) covers a space above the base plate, making an enclosure. The joint face between the base plate and the cover is hermetically sealed to hold a nitrogen atmosphere. Several interconnection leads (14) are formed through the cover and electrically connect circuits on the base plate and the substrate. A pair of interconnection leads (15) test operating signals in the semiconductor devices.
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