| 摘要 |
PURPOSE:To accurately grasp the attitude of a BGA package by detecting a solder ball as images of plural small grains having area larger than a specific minimum value and less than a specific maximum value, and finding the gradient of the package from the gradient of the straight line connecting those images. CONSTITUTION:When the package is gripped by the grip part of a surface mounting machine, the package is conveyed to in front of the photographic lens of a camera 1. The camera 1 picks up an image of solder balls arrayed on the bottom surface of the package and the image data are stored in an image memory 3. Then, a CPU 6 starts a specific program. Namely, a detecting means (CPU) 6 when supplied with image data on the bottom surface of a ball grid array(BGA) type package, detects images of plural small grains having area larger than the specific minimum value and less than the specific maximum value. Those images correspond to the solder balls of the BGA type package. Then, an arithmetic means (CPU) 6 finds the gradient of the package from the gradient of the straight line connecting those images. |
