发明名称 PLASMA PROCESSING METHOD
摘要 <p>PURPOSE:To acquire a plasma processing method wherein the temperature of a sample substrate during plasma processing can be kept fixed, a high frequency voltage applied to a sample substrate can be monitored and deterioration of an electrostatic chuck can be prevented. CONSTITUTION:The title method is constituted so that a substrate is held on a mounting stand 4 whose temperature is controlled by an electrostatic chuck 1 which is formed of a conductor 1a and a dielectric 1b involving it and holds the substrate mounted on the dielectric 1b removably by using static electricity, and static electricity is generated by applying a voltage through the mounting stand 4 between the dielectric 1a and a sample substrate 2 when the sample substrate 2 is processed by plasma inside a vacuum container 3. Thereby, the temperature of a sample substrate during plasma processing can be kept fixed.</p>
申请公布号 JPH07321185(A) 申请公布日期 1995.12.08
申请号 JP19940109582 申请日期 1994.05.24
申请人 KOBE STEEL LTD 发明人 NOZAWA TOSHIHISA;KINOSHITA TAKASHI;NISHIZUKA TETSUYA
分类号 H01L21/302;H01L21/203;H01L21/3065;H01L21/68;H01L21/683;(IPC1-7):H01L21/68;H01L21/306 主分类号 H01L21/302
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